@CUJOHN: I will answer you quoting the metallurgical compendium:
I will add: The ability to cover plating uniformly is called throwing power. The better the "throwing power" the more uniform the coating.
Quote:
The anode is connected to the positive terminal and the cathode (metal to be plated) is connected to the negative terminal. Both are immersed in a solution that contains an electrolyte and connected to an external supply of direct current. When DC power is applied, the anode is oxidized.
Metal atoms dissolve in the electrolyte solution and ions are reduced at the cathode forming a coating. The current through the circuit must be adjusted so that the rate of the anode being dissolved equals the rate at which the cathode is plated.
The anode is connected to the positive terminal and the cathode (metal to be plated) is connected to the negative terminal. Both are immersed in a solution that contains an electrolyte and connected to an external supply of direct current. When DC power is applied, the anode is oxidized.
Metal atoms dissolve in the electrolyte solution and ions are reduced at the cathode forming a coating. The current through the circuit must be adjusted so that the rate of the anode being dissolved equals the rate at which the cathode is plated.
I will add: The ability to cover plating uniformly is called throwing power. The better the "throwing power" the more uniform the coating.
Edited by silviosi
05/19/2022 5:27 pm
05/19/2022 5:27 pm