Hello again, I have come across this 1979 D penny. Seems to be something going on with the top of the memorial building on the reverse. At first, I thought die crack. But it doesn't seem to be raised. So, just wondering if anybody has seen something like this. Thank you so very much.
Keep in mind that that area is where die clashes affect the design.
Note the dies devices are smaller than a normal example? That is because of a lot of die clash events happened to this die. On one of the recent clashes, the unusual happened. The outlines of the bust and memorial actually made contact on that area. Starting a possible die break/chip on that area. That is what you are seeing that happened to this die. Each time the die is polished, the fields are having more of the surface of the fields reduced in size. So the devices get smaller as they are tapered on the die:
Note the removal of the fields reduces the height and width of the devices? On this die, the reduction allowed part of the deeper devices to be affected. The affect on the devices can either remain the same, or continue to crack while this die is continued to be used. The more we learn about coins, then the answers become about: "What happened here?" Knowing the process of die wear, abrasion, clashing events, all came together with this coin. It is the finger prints of these two dies. Knowing what did happen, then makes sense now, because of this coin. If is just another die event, but an important one as it reveals what can/does happen to dies.
CoopHome: What can happen to dies as they are continued to be rescued to remain to continue doing the job they are created to do?