Die gouges/scratches on the fields. The fields on the die is the outside of the die. The devices are deeper into the die. So die polishing affects the fields. Thus the lines you are seeing on on the fields (incuse on the die) and raised on the coins. It is a common die event.
The opposite can happen on incuse devices, where the tops the coins devices are showing coin damage and not deep enough to affect the incuse device. When it is deep enough it can affect these incuse devices: This second incuse example if just coin damage though.
Blurry pixs, however the 4 corners of the Memorial building are the most common places for die cracks to appear. So I'd say you have a better than 50/50 chance that it is a die crack...good luck on future finds
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