Some obverse devices display weaken results from die polishing. The reverse in the second bay, displays potential die defect that maybe from the known recurring die subsidence error (a.k.a., sunken die).
Concerning the opposite sided obverse and reverse false rim, I would check the diameter and edge closely to rule out potential collar issues as well as verify the weight. Thanks, Doug.
Correct answers, Halo and Variteys. Why are they correct? Machine Doubling affects the devices after the strike. These were messed up on the die, and the devices were struck smaller. So die polishing is the cause. The more the die is polished, the less detail remaines Not a struck though grease issue. Why? Because the devices would be wider than normal as the grease affects the deepest part of the die. Thus the taper of the devices would be missing. Instead the devices are smaller than normal because the fields were reduced.
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