First Page
Previous Page
Posted 05/22/2023 12:08 pm
What happens to damaged coins?
CoopHome: Damaged coins
If it is a die issue on a struck coin, it will be raised. If it is pressed into the coin, then it is damage. A die chip that is missing part of the design will be raised above the surface of the coin. A die crack will also be raised above the surface of the coin. A coin scratch will be incuse, below the surface of the normal coins design. Incuse devices on a coin will be below the surface of the coin. If there is damage on the surface of the incuse devices, they will also be slightly below the surface of the coin. Damage to a coin is below the surface of the normal coin more or less, depending on the train wreck it went through. Damage is never a plus for a coin, just making the coin into a face value only coin. When these coins get back to the banks, they will be set aside and returned to the mint to be cancelled and scrapped. If the coin can still be used, it is left in circulation.
Click on the link below to see the full discussion of this subject.
http://goccf.com/t/446041#3850239
Die polishing reduces the size. How? The die has the opposite appearance than the coin. What? Everything raised on the coins will show on the die as deeper into the dies.
Besides being mirrored the fields are the outside edge of the die. The devices are deeper into the die. The taller the device is on the coin, the deeper the devices will be into the die. Note the outer edge of the die has a gutter? That is what helps for the rim on the coins outer edge of the design, protecting the devices on the coin. When a die is polished, what is affected first? The fields. These are often altered first on the die. The later die wear will affect the incuse devices on the die. But when a die is polished, the devices bases are the widest/tallest parts of the design. When the polishing happens, the bases of the devices will be reduced in size, making the devices shorter and thinner as the die gets the fields polished more and more times. Why are the devices tapered? If they weren't the coins would strike to the dies post strike. So the tapering of the coins prevents them from being stuck on to the dies. What is why the devices will be reduced in size as the fields are polished away. On a doubled die, the devices are enlarged on the die because of the hub creation on the die. Thus looking for enlarged devices is what to look for. Reduced devices are just a normal die that was over polished. Hope this helps?
CoopHome: Why are some devices reduced in size on the coins?
Click on the link below to see the full discussion of this subject.
http://goccf.com/t/446014#3850265
CoopHome: Damaged coins
If it is a die issue on a struck coin, it will be raised. If it is pressed into the coin, then it is damage. A die chip that is missing part of the design will be raised above the surface of the coin. A die crack will also be raised above the surface of the coin. A coin scratch will be incuse, below the surface of the normal coins design. Incuse devices on a coin will be below the surface of the coin. If there is damage on the surface of the incuse devices, they will also be slightly below the surface of the coin. Damage to a coin is below the surface of the normal coin more or less, depending on the train wreck it went through. Damage is never a plus for a coin, just making the coin into a face value only coin. When these coins get back to the banks, they will be set aside and returned to the mint to be cancelled and scrapped. If the coin can still be used, it is left in circulation.
Click on the link below to see the full discussion of this subject.
http://goccf.com/t/446041#3850239
Die polishing reduces the size. How? The die has the opposite appearance than the coin. What? Everything raised on the coins will show on the die as deeper into the dies.
Besides being mirrored the fields are the outside edge of the die. The devices are deeper into the die. The taller the device is on the coin, the deeper the devices will be into the die. Note the outer edge of the die has a gutter? That is what helps for the rim on the coins outer edge of the design, protecting the devices on the coin. When a die is polished, what is affected first? The fields. These are often altered first on the die. The later die wear will affect the incuse devices on the die. But when a die is polished, the devices bases are the widest/tallest parts of the design. When the polishing happens, the bases of the devices will be reduced in size, making the devices shorter and thinner as the die gets the fields polished more and more times. Why are the devices tapered? If they weren't the coins would strike to the dies post strike. So the tapering of the coins prevents them from being stuck on to the dies. What is why the devices will be reduced in size as the fields are polished away. On a doubled die, the devices are enlarged on the die because of the hub creation on the die. Thus looking for enlarged devices is what to look for. Reduced devices are just a normal die that was over polished. Hope this helps?
CoopHome: Why are some devices reduced in size on the coins?
Click on the link below to see the full discussion of this subject.
http://goccf.com/t/446014#3850265
Edited by coop
05/22/2023 1:08 pm
05/22/2023 1:08 pm
Back! 
