I don't see if flowing over the 'E' on WE. So because it is not giving, it is not a linear plating bubble. Bnd because it flow behind the devices and the bust, it must be a die gouge. A die crack would be raised, and if it went over a device, it would show on top of the devices.
A die crack will have a sharp crisp line. Why? Because when a die cracks, it leaves open a void on the die:
Note on the image on the left on the back: Note the crack across the surface of the die? That is an open void on the die. This will leave a strong raised area on the coins stuck with that die. On your coin, the sharp line is not seen. Just a gouge on the surface of the die.
They are not cracks, but damage to the fields of the die. They leave a raised area, but not as hight to a point like a die crack.