Keep in mind, there is coin polishing and die polishing. Coin polishing removes detail off the coin:
Die polishing affects the fields and when they are reduced the dies will be reduced making the devices smaller:
Areas in a clash area can be affected:
sub devices because flat when the polishing removes the fields too much:
So there are two types of polishing. Your thinking of one, he is thinking of another type of polishing. So to advoid the wrong idea, using terms like coin polishing and die polishing would help add more to the thought, only adding one word each time.