These devices are incuse. When the die move on incuse devices, it enlarges them. So the doubled dies are reduced on incuse devices. Raised devices on doubled die: Incuse devices on doubled die: Hub doubling shows up opposite on raised and incuse devices.
Yes, I am sure. On the incuse designs the bouncing of the die can land pretty much anywhere, and leave the imprint smaller. Wexler explains it better than I can. http://doubleddie.com/144822.html
The same way dies move during the strike that give the reduction of machine damage, just opposite. The devices on the die are raised, leaving incuse design on the coins.
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