The area you are looking at is where the devices were altered during the strike. The overall size of the devices is there, just damaged during the strike. If it were hub doubling, then you would see the devices enlarged:
Here is a DDR on the same devices:

Note the lines on the contour of the devices? That is from the miss hubbing during die creation. Note the color of the devices. Note how they go from light to darkness? On a machine damage device will have the area in question look just one color because it is flat. Also the devices on a doubled die will be enlarged.
Note the machine damage on these devices:

The devices are reduced from the damage on the devices. That is what caught your attention. You are correct about it being MD.
Here is a DDR on the same devices:

Note the lines on the contour of the devices? That is from the miss hubbing during die creation. Note the color of the devices. Note how they go from light to darkness? On a machine damage device will have the area in question look just one color because it is flat. Also the devices on a doubled die will be enlarged.
Note the machine damage on these devices:

The devices are reduced from the damage on the devices. That is what caught your attention. You are correct about it being MD.






















