The devices in the ring area of the ATB Quarters, are incuse. (raised on the die) So when a slight amount of die movment happens during the strike (sloppyness of the mechanism/bounce after the strike) it makes the die touch again and not in the same place. That is why you will see this as a weak second area affected. Sometimes it is just one device and others several in a row. Note on this set of images the MD is not the same on every device. It is random because of the die movement during the strike. But always weaker on incuse devices.
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