I'll be nice... For a change...

...maybe... Back in bed(sick)so no files to reference.
Are you referencing the area under the top and center curve? That is a really slight MD, moved slightly as die settled down on strike. I think of a strike like a hammer hitting a nail. It bounces on that hit, landing multiple times, in different places and angles as the energy bleeds off. Same principle here when coin is struck. Hammer die(hmmm, called for a reason?) bounces, depending on pressure, wear of surfaces, tightness of holding mechanism, it moves around, twisting, bouncing. As it does, the edges of the incused devices(die face is flat) are sharp. They catch on the upper part of the newly created device and can dent it, smash it and push some of the edge down, like here. It stripped a part of metal, pushed it down to the coin on the downward bounce.
Now, think. How are RPMS made? They are punched into the dies. Similar in manner to how a doubled die is made. It involves movement in the formation of the die for use, not the use of the die. When punching in the metal, movement maybe done, twisting or slight shift in position. As Coop and others have tried to explain, this movement shows up in the more central part of the device, because this INCREASES the size of the device, an adding to the original. MD always reduces the overall device size, and shows up on the edges, not on the center of the formed device. The key here is to train your eyes where to look. Get away from looking at the field and edge of devices, look at the top center for slight lines of separation, or the tips for a notching. RPMs vary slightly, but these principles apply. Hope this helps.