As mentioned the outside devices on the reverse are incuse devices. (Below the fields) When the machine moves before/during/after the strike the die movement with the raised devices on the edge of the die, will alter the devices. This happens actaully quite often. 70% of the time in a mild/medium/strong way. These are not doubled dies. They can vary in strength from strike to strike. The
DDR's are not located on this area of the die. The doubled dies on the States and
ATB Quarters are on the central areas of the die. Earlobe/motto area on the obverse. Center of the design on the reverses.