On the edges of the devices, that is Machine Doubling. Die doubling is seen on the center areas of devices. Machine Doubling reduces the edges of devices. Hub doubling enlarges the devices. Think of a rubber stamp when your trying to put one stamp over the exact same spot the second time. It never matches up. Machine Doubling is caused by the machine. A doubled die is on the die. So each strike is the same. Machine Doubling is random. An accident after the strike. Of different from strike to strike. Looking at these images, do you see anything enlarged? MD reduces. On these images these devices were damaged after the strike. Flattened. on the first examples you look at the doubling enlarges, doesn't flatten, but creates almost two images on the device area. All because the doubling is on the die.
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