As mentioned this is classic Machine Doubling. On the curved devices you will note the reduction of the devices sizes on those areas the most. On the image with the 'RIC on America, note how the devices are reduced in size by the MD. Top inside part of the 'R', On the 'C' you can see the reduction on the lower area of those curves. If this were a doubled die, those areas would be enlarged, but they are not. This is cause by the machines die hitting those fresh new devices, altering them from machine movement. A doubled die has the doubling on the die from the hub process. Machine Doubling can also alter doubled dies, but most often we see this on strikes of normal dies. Here is why the altered areas are reduced in size:
Note on this side by side of Machine Doubling and hub doubling (doubled die) with tape to show the flattening and the doubling differences. Hope this helps.

Note on this side by side of Machine Doubling and hub doubling (doubled die) with tape to show the flattening and the doubling differences. Hope this helps.

























