Keep in mind that more than one event can happen to a coin.
1. Looks like MD on the 'O' on God.
2. The flattening could be from circulation damage, or happen during the coin wrapping/counting could have altered some device and damage some also on the area next to the rim.
3.
Die Deterioration is mostly found on the area between the outside edges of devices towards the closest rim direction. Also the fields can develop on the fields from the constant flow movement from the center of the die to the rim.
4. On the obverse die it looks like it was over polished from clashes. Note how all the devices look smaller in size than a normal coin. (Die polishing removes the height of the fields. When this happens, the shortens the width of the devices.

This thinning happens when the field/sub devices are reduced.
5. Reverse dis is also showing the same die polishing reducing the size of the devices.