1989 Lincoln Memorial Cent / LMC Reverse Die Chip + Doubled Die Reverse / DDR ?

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Author	Replies: 10 / Views: 1,322
RobO411 Pillar of the Community United States 2404 Posts	Posted 07/25/2020 9:59 pm To start sorry about Obverse and Reverse shots couldn't get clear pictures for some reason. So I'm sending a few more pictures than usual. On reverse all letters are thick. There is a die chip between NE of ONE. I need your input about the thickness of every letter. OE of ONE looks doubled. EN of CENT has slight notching NW. (Lol) I have a lot of pictures but only sending a few but they should do. Thank you for opinions. Report this Post to the Staff

SilverCents Pillar of the Community United States 3281 Posts	Posted 07/26/2020 12:38 am Yep a nice die chip. I'm thinking it's just light MD, nice photos! Report this Post to the Staff
RobO411 Pillar of the Community United States 2404 Posts	Posted 07/26/2020 10:11 am Thanks SilverCents. Doesn't the letters look extra thick? Check out Coppercoins #008 Report this Post to the Staff
SilverCents Pillar of the Community United States 3281 Posts	Posted 07/26/2020 10:54 am My guess is just die polishing is causing that effect. Also there is no DDR #008 on CC. Report this Post to the Staff
RobO411 Pillar of the Community United States 2404 Posts	Posted 07/26/2020 11:57 am You're right SilverCents my bad. It's 89D-008. When I checked 89P nothing close. Then looked 89Ds 006-008 has similar thickness. I neglected to point that out on original post. Thanks for pointing that out. Edited by RobO411 07/26/2020 12:06 pm Report this Post to the Staff
CoinHunter17 Pillar of the Community United States 1008 Posts	Posted 07/26/2020 12:33 pm with SC. Note the die polishing lines above the E in ONE. Report this Post to the Staff
coop Bedrock of the Community United States 62064 Posts	Posted 07/26/2020 12:35 pm Keep in mind this was the new RDV-006 master hub. It was fresh this year and the devices are larger than the 1988 cents. I'll have to make a side by side later to see if they are normal sized or enlarged. I do have a RDV-005 and 006 reverse devices on some areas to show the differences. Note even the EPU devices are normally wider as well. So I've got to be somewhere soon. But the devices on UNITED look a bit different to me than the normal RDV-006? (if those are your images?) Edited by coop 07/26/2020 4:20 pm Report this Post to the Staff
RobO411 Pillar of the Community United States 2404 Posts	Posted 07/26/2020 2:43 pm Thanks again everyone. Coop I'll be checking back. I went through about 40+ 89 this one was different. The others looked like 88 did. Did they change the obverse die in 89? I've went checking again. WDDR-009. My markers match those (sorta). The clash above memorial. The crack bottom left of memorial but not as large. The die gouge between IC of AMERICA is sorta there. It looks like they did a lot of grinding in that area. Edited by RobO411 07/26/2020 3:53 pm Report this Post to the Staff
SilverCents Pillar of the Community United States 3281 Posts	Posted 07/26/2020 3:48 pm Yep indeed Coop is correct. The 1989-1986 tend to have that master doubling. Report this Post to the Staff
coop Bedrock of the Community United States 62064 Posts	Posted 07/26/2020 4:54 pm Just United looks different. I wonder if the die was over polished? Report this Post to the Staff
RobO411 Pillar of the Community United States 2404 Posts	Posted 07/26/2020 6:35 pm Cool. So just die chip between NE-ONE. Thanks coop Report this Post to the Staff
	Replies: 10 / Views: 1,322

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1989 LMC Reverse Die Chip + DDR?