The die polishing alters the shallow sub devices. So on the bases of the devices, some shallow designs are removed from the die. Removing the fields shortens the height, removes the base design on these quarters. The top two images are from on die, the bottom two are from a different die, or different die state. ( the missing die scratches is the determining factor to my answer) The 'R' is smaller from die polishing.
Edited by coop
03/11/2021 03:27 am
03/11/2021 03:27 am






















