If it is a bubble, a toothpick will push it down on the plating there.
If it doesn't give and is firm, then it maybe a die gouge on that area of the fields. The reason I mentioned a second option it appears it flows behind the device, which we will see on a die gouge.
If it doesn't give and is firm, then it maybe a die gouge on that area of the fields. The reason I mentioned a second option it appears it flows behind the device, which we will see on a die gouge.





















