Note how the devices are affected?
1. You are looking at the outsides/insides of the devices where
Machine Doubling is always found. A doubled die will be enlarged in the centers of the devices.
2. Obverse dies on dimes pretty much were over with
DDO's after the early 1970's:
http://varietyvista.com/07%20Roosev...Listings.htmNote the ones in blue on that page. If it is not blue or have an underline on them they don't have a
DDO's that year.
3. The affect on the devices. On the first image you posted, the MD pushed the metal back and is raised taller than the rest of the device. A sure sign of
Machine Doubling. It removes the contour on the devices by machine movement right after the strike. A doubled die is created on the die, not caused by machine striking issues. MD can also happen on a doubled die, but the doubling will show both. MD and Doubled Die.
4. Note the fields: On those areas there is a lot of die flow. usually indicating die aging. Sometimes these are polished off the dies. But they come back after a few hundred thousand strikes. They are sometimes polished up to three times before they retire them. (the devices distort more and more as the dies ages. Also the height of the devices will get shorter and shorter each time they are polished as the fields and the bottoms of the devices are affected. Because of this happening the devices do get smaller in height/width.