Keep in mind that die clashes happen on coins. so when a die is polished, just the areas with the clash marks are the ones the concentrate on. So when polishing happens, you can see the other devices near these areas get weakened. So the design is a common feature. When die clashes happen these same common features will crash into each other when there is no planchet in place, damaging the areas near the coins centers, with a copy transferred to each other on the dies. When polished away, the same areas will be affected.
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