I'm leaning more toward MD. Note how the devices are thinned a bit? There is a little bit of die flow above the letters from die wear. Some split plating from a hard strike. Probably you can see more split plating on the reverse?
Hub doubling makes the devices larger because the die was incorrectly hub doubled.

Not the lower part of this image. You can see the enlarging of the devices on a 1995P-1DO-001 there.
MD reduces the devices a little or sometimes a lot.
Edited by coop
11/11/2015 1:23 pm
11/11/2015 1:23 pm


























