The first on maybe a Machine damaged, but it was probably not from the die, but may have happened while it was being ejected from the chamber. Just on e area affected on higher part of the device.
The second one looks like a it was slight machine damaged after the strike. All contact marks show the same direction. This time the devices even lower were affected. (jaw) So it probably was damaged slightly by the dies. While both are called MD, the events that caused I believe differ.
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