
It is an issue with a
Struck Through Grease issue in grease on the EPU area.
What happened to the other devices on the obverse is called
Machine Doubling. (I prefer the term machine damage) During the strike the movement of the dies move/bounce/slide after the strike altering the devices. This happen on both regular and hub doubled dies. (doubled dies) The MD causes the devices to be reduced in size leaving a flat, step like edge to altered device. This might help you picture this:

Note on this image how the regular device is in the center. The example on the left show MD that reduces certain areas of the device after the strike happens. The example on the right is a doubled die. The devices were enlarged on the die when the die was created. So on
Machine Doubling, the die is normal. During the strike it is altered reducing the overall size of the devices. But on the doubled die, the doubling is on the die, thus the term doubled die. On a doubled die, each of the coin struck with it will show the same doubling. (usually only affects one side of the coin) On
Machine Doubling it can affect one area (small or large) and sometimes bothe sides of the coin will be affected. So the ones people are look for to collect are the doubled dies. Not the machine doubled examples. Why not these? They are very plentiful out there. On the
ATB Quarters, this happens on about 70% of the incuse (sunken) devices. A lot more could be said, but beings that you are new, I'll just give you this for now. But if you have another question, ask.
Edited by coop
10/27/2017 3:13 pm