Seems Like This 1960-P Nickel Devices With Icicles-Need Winterizing

MD on date and some other devices. The sawtooth is Die Deterioration happening and on reverse surface stress cracking/chipping between letters.

It looks like the reverse devices are showing a lot of wear on the devices. On the obverse as mentioned it is Machine Doubling. The difference? The obverse die maybe from a different die pair than the reverse.

The reverse is a VLDS (Very-Late-Die-State) die. The lines on both sides are moving towards the rims. When it reaches the ends of the devices, they tend to turn direction to reach the rim. This is caused by die wear.

The obverse is a fresher die. Possibly LDS (Late-Die-State). The Machine Doubling on this die is shown in a directional movement of the die after the strike. There is some die wear showing near the rims on the opposite side of the devices of the MD areas. So on the obverse you see some die wear, but what catches you eye the most is the MD like on the date image. The die wear is from used of the die, but the MD is caused after the strike when the die moves altering those devices. This can happen on one device, one area of the coin or even more a lot stronger. But as I mentioned, this is caused by the machine. So neither sides are doubled dies. Just a normal pair of dies with die wear and an obverse die moving after the strike.