They start out as die flow lines, now they look like the die flow lines are growing die flow lines. The die is showing its age. Sometimes they polish the dies and they flow lines go away, but when they do that they reduce the surface of the fields and the devices get smaller. Thus sometimes isolated polishing will be concentrated on one area. Then the devices get smaller:

On an edge of the die damage may occur and when polished the device look thinner and normal at the same time.

On this one the outer edge of the die was polished down, leaving the tops of the devices affected.


Note on the image above how this happens. The fields are the outside of the die. The devices are deep into the die. (die is a negative and coins are a positive) Lowering of the fields reduces the height of the devices on the coins.

The more the fields are reduced, the more of the design will go away as well.