Posted 07/02/2019 7:25 pm
When a die is polished the device get thinner in size. Why? Because the devices are tapered so they will release after the strike. So the deepest part of the die devices are tapered the most on the die. The wider part of the die is the base of the devices on the coin, but are the closest to the fields on a die:
On this illustration the deepest part of the die fills with grease first, but that die is polished, it removes part of the field, thus making the devices lower in height and thinner looking because the base of the devices are reduced.
You have another reverse set of STATES and EPU that is showing a partial Grease Fill. When this happens the device are now lacking the tapered area (because of Grease Fill) and now look shorter in height and wider looking.
All these are die and strike events. No premium, but just knowing what causes it, it the premium for that information. Hope this helps.
On this illustration the deepest part of the die fills with grease first, but that die is polished, it removes part of the field, thus making the devices lower in height and thinner looking because the base of the devices are reduced.
You have another reverse set of STATES and EPU that is showing a partial Grease Fill. When this happens the device are now lacking the tapered area (because of Grease Fill) and now look shorter in height and wider looking.
All these are die and strike events. No premium, but just knowing what causes it, it the premium for that information. Hope this helps.
