That is caused by Machine Doubling. Yes, it is. The EPU devices are incuse on the coin, raised on the die. So when maching doubling happens on these incuse devices, they enlarge. On a doubled die, the incuse devices actually get smaller. How do I know. I discovered on the 2013 DDR. The raised devices were enlarged, the incuse devices are reduced: Incuse devices: Raised devices: This coin was a revelation to me. It opened up a new concept that I didn't realize until this coin. Thanks again for he coin, Steve Young. (A personal gift from him.)
For the coin above, it looks like the common shield crack that occurs in a lot of the Shield Cents...coop, good photos, I can see it. interesting how it warps one side.on the E PLURIBUS UMUM
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