That is extreme die wear. The devices are affected. On DDD the fields are affected and not the devices. Note the date, it is one of the multi squeezed dies. On the doubled dies the hub doubling usually affect the tops and bottoms of the devices:
Note my images on this thread to see what I'm talking about.
http://goccf.com/t/363743
Note my images on this thread to see what I'm talking about.
http://goccf.com/t/363743

























