Take another look at your images. You concentrating on the outside edges of the coin. A doubled die will have a spread in the centers of the devices. Wider or taller than normal. On this one as already mentioned, I see
Machine Doubling altering normal sized devices. No spread. On this design with the single squeeze process, it is the centers of the devices that have the target areas.:

Obverses of dimes is pretty much free of DDOs on the single squeeze dies.
Reverses are affected in the central areas.

Obverse nickel
DDO area is on the nostril area on the right side.
Reverse is the door area most on the upper part of the die on the
DDR.

Quarter obverse DDOs, Earlobe and motto areas affected
Quarter reverse DDRs, are on the central areas of the designs. Some designs will not have doubled dies because of the center area design would prevent a doubled die.
So look in the correct areas and stop just spinning your tires. Check out the sites on the design and see what is listed. Then look in those areas. Don't see anything there, move on to the next coin. Look too long and all you will find is more
Machine Doubling.