on the 'UNIT' the metal was pushed upards like moved snow. MD at its worst. Look for the spread in the centers of the devices, not on the outsides of the devices. That is where MD happens.

On the image I mentioned, check what a
DDR could look like on that area:
uploaded/coop/1968-D_25c_quarter_DDR__DDO-001_FS-801_AAA.jpg
Note the closed devices with the centers smaller than normal. That is what to look for. Forget the outside edges. They will just find you
Machine Doubling. Centers of the devices will be enlarged on a doubled die. MD reduces the normal size of the devices. It shoves the metal aside after the strike.