It is all machine damage to these devices. The movement of the dies during a bounce created MD during the strike. The bounce is moved off the normal strike and created an altered location during the bounce. These devices are incuse on the coin. (raised on the die) when MD happens with raised devices, then you will see what looks like doubling, but it is not on the die, but occurred during the strike. All images are mirrored on the original post. The
ATB Quarters show a lot of machine damage during the strike. I'm still hoping for an example of incuse device hub doubling for quarters. So far I have an example of this incuse
DDR devices on a shield sent. On hub doubling on incuse devices, the devices are actually smaller than normal.



How do I know these are the result of hub doubling? The rest of the reverse shows on the raised devices they are enlarged:


These images are all from the same coin.