Machine damage on a coins devices will reduce the overall size of the device.
Die Deterioration will show towards the closest rim. It enlarges the devices a bit, but usually not in a uniform fashion.
Die polishing will reduce the fields a bit and reduce the height of the devices on a coin. This will appear on the coin as thinner devices.
Hub doubling enlarges overall devices.
Die Deterioration will show towards the closest rim. It enlarges the devices a bit, but usually not in a uniform fashion.
Die polishing will reduce the fields a bit and reduce the height of the devices on a coin. This will appear on the coin as thinner devices.
Hub doubling enlarges overall devices.





























