to the CCF!
Posted 11/29/2020 11:08 pm
First you need to know what raised and incuse marks are on a coin.
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Most of the devices are raised on a coin, but not all. Damage to a coin is about 99% of the time, just damage to the coin. It leaves an incuse mark on the coins. A die crack is raised above the surface/devices/design on a coin.
These are raised.
Here is die crack that flows on the fields, over a device and now showing also a die chip.
This one is flowing across all three. Note you can see it on it journey:
But on the ATB Quarters, there are incuse devices on the other area of the reverse ring. Note the marks on the area on the ring you circled. These are also incuse damage on the coin. While it looks like it flows behind the devices, it is a contact mark on the field. The devices in that area are incuse. Just the opposite of a raised device. On the area of the ATB reverses, there are no doubled dies on these incuse devices. The DDR are found in the central area of the design.
Most of the devices are raised on a coin, but not all. Damage to a coin is about 99% of the time, just damage to the coin. It leaves an incuse mark on the coins. A die crack is raised above the surface/devices/design on a coin.
These are raised.
Here is die crack that flows on the fields, over a device and now showing also a die chip.
This one is flowing across all three. Note you can see it on it journey:
But on the ATB Quarters, there are incuse devices on the other area of the reverse ring. Note the marks on the area on the ring you circled. These are also incuse damage on the coin. While it looks like it flows behind the devices, it is a contact mark on the field. The devices in that area are incuse. Just the opposite of a raised device. On the area of the ATB reverses, there are no doubled dies on these incuse devices. The DDR are found in the central area of the design.
Edited by coop
11/29/2020 11:13 pm
11/29/2020 11:13 pm
