Note on the last three images, the 'N' on UNUM:
1. Note the width of the two vertical devices on that area on the 'N'.
Note on the left side, the MD reduces the size of that device..
2. How is that device reduced in size? The contour of that device was pushed on the left side of the device.
3. Note the affected area is showing width at the bottom of that device, that it was there, but the
Machine Doubling pushed aside that device.
4. If it were a
DDR, both side of the device would be enlarged and the same size.
So
Machine Doubling reduces the size of the devices after the strike. On a doubled die, the doubling is on the die and would be enlarged on several of the devices, often the same:

