Posted 01/12/2009 4:31 pm
It is interesting how many small obverse die chips were present on Lincoln cents in the 50s. 
Perhaps they're more common than previous years simply because of larger runs / more obverse dies?
Or, was there a new die composition/hardening process that was resulting in brittle dies? I seem to notice fewer die chips into the 60s-70s--but my experience here is limited.
Perhaps they're more common than previous years simply because of larger runs / more obverse dies?
Or, was there a new die composition/hardening process that was resulting in brittle dies? I seem to notice fewer die chips into the 60s-70s--but my experience here is limited.
