Flow lines from die wear on the die. Keep in mind, the fields are the outside part of the die. So the die wear shows as lines across the field areas. When polished off, if not fully removed, the void on the die will show up as a raised area on the coin. Thus this is not a doubled die. All the devices would be showing the same thing on that area if it were a doubled die. That is what you are seeing on this coin.
https://www.coppercoins.com/lincoln...ie_state=edsNote on the
DDO, the spread for a doubled die, makes the devices taller on most of the devices, not just affecting one single area on a device. So look for the spread of the devices. Depending on the affected hub doubling, it could be taller/wider/rotated on several of the devices on that area. So what you should be looking for the spread/enlarging of the devices. Not the outer edges of the devices. That is where die polishing affects the devices, reducing the size of the devices.

Note how the spread is seen as enlarging the size of the devices because of the hub doubling?
Edited by coop
05/15/2023 11:58 am