On the older style of the dies with the higher profile and the multi hub process, the die wear often showed the strongest on the out edges of the devices near the rims. Often just the outer edge would loose it outer curl, then it would progress to alter the devices further in on the devices.

Eventually the die wear can make the whole device, appear to have moved to the rim:










The die wear pattern lasted a lot longer, but eventually all dies wear out as the continuous same pattern of moving the metal always in the same direction.
But on the single squeeze dies, the profile is a lot lower. The die wear or
DDD (Die-Deterioration-Doubling) is different. Instead of affecting the devices, it is affecting the fields, and not the devices.

Note the devices are not affected, but the
fields are.
Thus the die breakdown is different. When it starts, it starts on the fields near the closest device to the rim. And after a lot more coins it will start to show on devices, closer and closer to the center.
DDD is always in the same direction. To the rims. The breakdown gets so bad that some of the 1980's Zincolns show
Ridge Ring that sometimes rose so tall the devices would no longer form. (A form of
Die Deterioration)





When these die are polished, some of the polishing removes totally parts of the depth of the devices that were there. So the metal of the fields maybe moving towards the rims during this breakdown.


But on either processes, die wear affects the devices. As mentioned in at least two, and maybe three different ways. Hope this helps?
CoopHome:
What is DDD and Ridge Ring have in common?