Note that all the affected areas are expanding on the fields in the direction of the closest rims. So this it
DDD (
Die Deterioration Doubling) this can be seen on the single squeeze dies.

The designs have the lower profile doubling. Thus only the fields are affected by the die wear process. Note all the devices are normal is shape, only the fields are affected. (If the coin was a doubled die and aged, it also could have a doubled die and the
DDD present. Doubled dies are created during the die making process. Die wear and
Die Deterioration is a die wear issue that happens on all dies. (even doubled dies) Two different causes. This coin would be helpful as a 'show and tell item' to show to new collectors, that
DDD process on the single squeeze dies and why this is not a doubled die. This coin shows the affected areas on both sides of the coin. The die wear is removed by die polishing on the coins. But the devices will get smaller on each polishing as it removes the bottom areas of the base of the devices. So when the devices look smaller than normal, that die polishing will have reduced the base of the devices.

This also is used to remove
Ridge Ring from the dies as well. (The slightly sub devices will be polished away fast, thus the initials, and other area of these sub devices will disappear with the die polishing)

Thus these missing devices, were there, but now removed. Thus all the hype of the missing devices, that were not forgotten, but removed by die polishing. (A plus for the graders as they sell this process. A bad deal to true collectors as they know they are just a die polishing issue and don't fall for these)
CoopHome:
What is DDD? How are dies affected by this process and how is the damage removed? die wear on the single squeeze dies is different than the die wear of the older style die creation. the die wear showing the fields of the
DDD examples and on the older processes, the device design is reduced by the die wear that affects the devices:
Multi-hub processes of the past, affecting the outside edges of devices.
thus you can tell the two different die creation processes. (by the die wear pattern on the outer edges of the devices being affected first)
this affect on the fields of the
DDD dies is used to remove these die wear lines on the fields and the removal of Ridge Rings seen on the
DDD die coins. This reduction alters the devices size (removing the bases of devices) and sometimes weaken the devices to the point that they are completely removed on the dies. So both Die wear and die abrasion, speeds up the retirement of these dies.