The reason? How it affects the devices/fields on the two processes.
1. The profiles are different on the older style dies. The older designs are taller. So die wear affects the devices.

2. On the single squeeze process, the devices are not affect, but the fields are. This I feel the lower profile height of the devices are the cause. Thus when I think
DDD, I visualize of the fields. On the multi hub dies of the past, the devices are the ones affected.

3. So on the older style dies, the devices actually move towards the rim. On the
DDD examples the fields are affected, the devices don't move. The ridge rings are the movement towards the rims. They are polished then the devices are reduced in height/missing as the die continues to age.



Both are extreme die wear, but the results are different on each type of die creation. Seems more like the zinc cents are the most affected with
DDD. Die wear/extreme die wear is a better term for both, but when I think
DDD the fields are affected. On the extreme die wear on the older die styles, the device actually move towards the rims.
Edited by coop
12/24/2022 3:30 pm